JobsSr Staff or Principal Thermal Engineer, Server Packaging (San Diego)
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Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego)

Qualcomm

Location

San Diego, CA

Type

Full-time

Posted

7/11/2026

Compensation

$180,400 - $270,600 per year

Master's with 5+ Years of Experience
H-1B FY202698.1% approval-22% YoY
👑 Elite sponsor

Job description

The Qualcomm Data Center team is focused on developing high-performance, energy-efficient server solutions for data center applications. The role involves creating thermal solutions for server products, addressing complex thermal management challenges. The qualified individual will work closely with various stakeholders to lead thermal architecture solutions and conduct simulations and tests. This position requires a deep understanding of thermal management design elements and the ability to communicate technical content effectively.

Requirements

  • MS in Mechanical Engineering is required, with a PhD preferred.
  • 10+ years of industry experience in electronics cooling related to server products.
  • Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
  • Ability to write scripts in programming languages such as Python, C/C++, or MATLAB for data analysis and tool development.
  • Expertise in conducting CFD simulations and proficiency in software tools such as ANSYS-Icepak and Celsius EC.
  • Capability to design and execute thermal tests within a laboratory environment.
  • Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.
  • Excellent presentation, negotiation, and communication skills.
  • Some experience with AI/ML concepts, algorithms, and methodologies is a plus.

Responsibilities

  • Lead thermal architecture solutions through simulation and testing.
  • Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout the product development phase.
  • Drive direction and strategy discussions while working cross-functionally with technical leads.
  • Conduct thermal design reviews and presentations.
  • Develop custom software solutions to automate thermal modeling and testing.
  • Conduct thermal tests to validate and characterize models and present results to stakeholders.
  • Analyze and document simulation and test results.

Benefits

  • Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Qualcomm Technologies Inc

As of Jul 17, 2026

Initial approvals

198

FY2026

Approval rate

98.1%

FY2026

LCA certified

59,278

FY2026

Entry-level share

0.0%

FY2026

Initial approvals YoY

-22%

Trend

LCA certified YoY

+30%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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