As a Process Integration and Yield Engineer in Defect Metrology at Intel, you will play a crucial role in enhancing manufacturing excellence and driving technology transfers. This position focuses on optimizing processes and improving yield in both startup and high-volume production environments. You will collaborate with various stakeholders and utilize advanced data analysis techniques to influence technical directions. Your work will directly support Intel's commitment to delivering industry-leading products and innovations.

• Ph.D. degree with 4+ years of semiconductor industry experience or a Master's degree with 6+ years of relevant experience in a Scientific STEM field.
• Experience in semiconductor processing and fabrication techniques such as Lithography, Etch, CMP, and Thin Films.
• Proficiency in Statistical Process Control and Design of Experiments principles, as well as data analysis using JMP/JSL and Python.

• Perform detailed data analysis to identify the root cause of defect and yield issues.
• Drive low yield analysis and yield improvement activities in collaboration with stakeholders.
• Design and implement continuous improvement initiatives to prevent quality and yield excursions.
• Develop and establish procedures and equipment configurations for process modules.
• Conduct quality and reliability risk assessments for manufacturing materials and process changes.
• Lead quality and integrated defect measurement in manufacturing environments.
• Mentor team members and influence technical direction across Intel and the industry.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.