The IC Package Design Engineer role at Qualcomm involves working within the Data Center team to develop high-performance, energy-efficient server solutions. The position requires collaboration with multi-functional teams to optimize package design for various chips, ensuring mechanical, electrical, and thermal performance. The engineer will also drive innovations and efficiency improvements in package design while exploring new CAD tools and verification flows. This role is ideal for individuals with a strong background in electrical, mechanical, or material engineering.

• Master's degree in electrical engineering, mechanical engineering, material science, or related fields with 5+ years of experience.
• Proficient in Cadence APD & SiP.
• Basic knowledge in high-speed IO interfaces and electromagnetic field.
• Knowledge of IC packaging structures and chip-package interaction.
• Familiarity with various sophisticated package configurations and assembly/substrate technology.

• Own and drive advanced package selection and configuration optimization.
• Responsible for package/SIP physical design, layout, optimization, DV, and tape out.
• Work with multi-functional teams to achieve optimized performance for various types of chips.
• Implement the physical design of packages and modules for SoC.
• Interface and coordinate with multi-functional groups on new product package feasibility analysis and design.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.