The Qualcomm Package Electrical Team is seeking a candidate with expertise in signal integrity and power integrity to optimize package designs and perform system simulations. This leadership role involves collaboration with package and IC designers, PHY owners, and PCB designers to ensure system-level performance meets specifications. The candidate will lead a team of engineers across multiple international locations and provide technical guidance to upper management. The position requires independent work and the ability to develop design guidelines and automate processes.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of relevant experience, or a Master's degree with 5+ years of experience, or a PhD with 4+ years of experience.
• Experience in AUTO package design and analysis.
• Ability to use AI to enhance team efficiency.
• Experience in SerDes design specifications such as PCIe Gen-x, USB, UFS in Server design.
• Experience in Matlab for automating simulation flows.
• Proficiency in programming languages such as C/C++ or scripting languages like Perl/Python is a plus.

• Perform package extraction for time domain and frequency domain analysis.
• Conduct system-level analysis for DDR, SerDes, and mixed signal interfaces.
• Provide design guidelines for package design.
• Perform system simulation and provide feedback for design optimization.
• Develop design and analysis flow and automate the process.
• Create technical documentation and presentations.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.