The role is part of the Qualcomm Data Center AI Hardware Engineering team, which focuses on designing and developing motherboards and add-in cards for AI System On Chip (SoC) and System In Package (SIP). The team collaborates with various cross-functional teams to execute projects from concept to production, supporting rack-level design and integration. This position offers the opportunity to work alongside industry experts in a fast-paced environment, addressing complex challenges in AI infrastructure. The role emphasizes both hardware engineering and system integration.

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
• Proven experience in rack-level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules.
• Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery.

• Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans.
• Co-develop functional specifications for systems, cards, sub-systems, and rack-level architectures.
• Collaborate with internal teams and ODMs to develop and support customer-specific hardware and system requirements.
• Facilitate consensus on technical trade-offs at hardware, software, and chip design levels.
• Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design.
• Participate in the design and development of rack-level inference solutions, ensuring alignment with customer requirements and system-level performance goals.
• Resolve architecture and design issues across system, card, and rack levels.
• Assist in the bring-up and debugging of hardware systems, cards, and rack-level configurations.
• Provide technical oversight of factory and manufacturing processes, ensuring quality and consistency across rack-level deployments.
• Contribute to writing Statements of Work (SOWs) and ODM product requirements; drive technical milestones and deliverables.
• Coordinate across multiple development sites, including Qualcomm locations and ODM/JDM partners in Taiwan and internationally.
• Travel to development and customer sites as needed to support rack-level solution deployment and validation.
• Influence and communicate technical recommendations across disciplines and geographic locations.
• Coordinate and deliver technical training for ODMs, with a focus on rack-level system integration and deployment.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.