The AMD Adaptive and Embedded Computing Group is seeking an experienced package design engineer to work on multiple package families for FPGA devices. This role involves collaborating with chip, technology, and systems teams to define cost-effective and high-performance solutions. The ideal candidate will have strong communication skills and the ability to translate electrical requirements into manufacturable package technology. The position is high visibility and requires a proactive approach to project management from design start to signoff stages.

• Bachelor's or Master's degree in Engineering
• Current working knowledge of Cadence package design tools
• Experience in package/PCB layout, especially for high power and Gbs IO products
• Good understanding of various Organic/PCB technologies
• Knowledge of SerDes design and package/PCB layout constraints

• Use Cadence tools for design, modeling, and simulations to enable timely closure of designs.
• Define package/module design requirements using analytical and simulation tools during project conception stages.
• Conduct routing, stack-up, and component placement studies while completing package design activities.
• Collaborate with PCB Layout Engineers to optimize the package ballmap and die size.
• Develop multi-signal package/module models over 50 GHz bandwidth and suitable test structures.
• Perform Power Integrity analysis for core and IO, generating power delivery network requirements.
• Develop scripts for checking package parameters across device families and maintain a database of electrical design guidelines.

• AMD provides a competitive 'Total Rewards' package that focuses on financial growth, health, and work-life balance.