JobsSr. Mechanical Engineer, Annapurna Labs, Artificial Intelligence Hardware
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Sr. Mechanical Engineer, Annapurna Labs, Artificial Intelligence Hardware

Amazon

Location

Austin, TX

Type

Full-time

Posted

8/5/2026

Compensation

$159,200 - $247,600 per year

Undergraduate with 5+ Years of Experience
Approval 98.6%·Filings 19,451·New hires 10,113·
👑 Elite Sponsor
·FY 2025

Job description

The Cloud Hardware Development Engineer (Thermal/Mechanical) at Annapurna Labs focuses on the thermal and mechanical architecture for ML/AI accelerator platforms. This role involves designing cooling solutions for high-power-density silicon and ensuring mechanical integrity across the product lifecycle. The team is responsible for delivering innovative cloud solutions that power AWS services at a global scale. Collaboration with various engineering teams is essential to drive the development of cutting-edge technology.

Requirements

  • BS degree in mechanical engineering or equivalent
  • 7+ years industry experience in Mechanical and Thermal design in electronics packaging
  • Experience in thermal and performance measurements and characterization on SoCs, Servers, or related Systems
  • 3+ years of experience in SoC Thermal modelling and IC package transient thermal response
  • Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems
  • Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging
  • Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies
  • Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams
  • Knowledge of generic mechanical room infrastructure such as chillers, cooler units, and fan controls
  • Experience in mentoring, leading, or managing more junior engineers
  • Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
  • Tool familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
  • Proficiency in 3D CAD modeling and engineering drawings per ASME Y14.5 (GD&T) standards
  • Programming experience: Bash script, Shell script, Linux, Python, and Lua
  • Knowledge of various types of technologies used for heatsink solutions, Thermal Interface Materials (TIMs), and liquid cooling technologies
  • Knowledge of hardware and software based thermal/power management control algorithms
  • Experience with liquid cooling system design: rack manifolds, cold plates, quick-disconnect fittings, CDU integration
  • Experience with mechanical design of high-density interconnect systems (cable cartridges, blind-mate connectors, backplane assemblies)
  • Experience with high-power-density ML/AI accelerator or HPC thermal design
  • Track record of driving cost optimization through vendor strategy, second-sourcing, or design-for-manufacturing improvements
  • Familiarity with manufacturing processes: injection molding, sheet metal fabrication, die-casting, and CNC machining
  • Experience with shock, vibration, and structural qualification testing per ISTA, ASTM, or equivalent standards

Responsibilities

  • Own the complete thermal and mechanical design for ML/AI accelerator platforms from rack-level infrastructure down to chip packaging.
  • Define thermal and mechanical design requirements and establish design targets.
  • Deliver production platforms through the full lifecycle including concept, design, analysis, prototyping, validation, manufacturing ramp, and fleet operations.
  • Design and optimize cooling solutions for high-power-density ML/AI accelerators.
  • Develop detailed CFD models and structural FEA for thermal analysis and mechanical integrity.
  • Design rack manifolds, cold plates, and data center liquid cooling interfaces for at-scale deployments.
  • Develop and validate mechanical structures for manufacturability, reliability, and serviceability.
  • Perform structural FEA for shock, vibration, and transportation loads.
  • Participate in on-call rotations monitoring fleet thermal telemetry for emergent issues.
  • Perform root cause analysis of thermal and mechanical failures in production.
  • Drive design standardization and engage with ODMs and component suppliers.
  • Lead design reviews and mentor junior engineers.

Benefits

  • Employees at Amazon are often offered comprehensive health benefits—including multiple medical plan options (no pre-existing condition exclusions, 100% covered in-network preventive care), dental and vision plans, a 24/7 medical advice line from day one, expert second-opinion services, and broad mental-health support with several free counseling sessions (including pediatric). Financial wellness typically includes a 401(k) with company match (up to 2%), Restricted Stock Units (equity), FSAs, an emergency savings program, product and partner discounts, and even college-savings and home-purchase programs. Overall, the package is designed to support employees and their families’ health, finances, and day-to-day life.

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