JobsSr. Mechanical Engineer, Annapurna Labs, Artificial Intelligence Hardware
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Sr. Mechanical Engineer, Annapurna Labs, Artificial Intelligence Hardware

Amazon

Location

Austin, TX

Type

Full-time

Posted

8/5/2026

Compensation

$159,200 - $247,600 per year

Undergraduate with 5+ Years of Experience
H-1B FY202699.1% approval+9% YoY
👑 Elite sponsor

Job description

The Cloud Hardware Development Engineer (Thermal/Mechanical) at Annapurna Labs focuses on the thermal and mechanical architecture for ML/AI accelerator platforms. This role involves designing cooling solutions for high-power-density silicon and ensuring mechanical integrity across the product lifecycle. The team is responsible for delivering innovative cloud solutions that power AWS services at a global scale. Collaboration with various engineering teams is essential to drive the development of cutting-edge technology.

Requirements

  • BS degree in mechanical engineering or equivalent
  • 7+ years industry experience in Mechanical and Thermal design in electronics packaging
  • Experience in thermal and performance measurements and characterization on SoCs, Servers, or related Systems
  • 3+ years of experience in SoC Thermal modelling and IC package transient thermal response
  • Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems
  • Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging
  • Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies
  • Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams
  • Knowledge of generic mechanical room infrastructure such as chillers, cooler units, and fan controls
  • Experience in mentoring, leading, or managing more junior engineers
  • Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
  • Tool familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
  • Proficiency in 3D CAD modeling and engineering drawings per ASME Y14.5 (GD&T) standards
  • Programming experience: Bash script, Shell script, Linux, Python, and Lua
  • Knowledge of various types of technologies used for heatsink solutions, Thermal Interface Materials (TIMs), and liquid cooling technologies
  • Knowledge of hardware and software based thermal/power management control algorithms
  • Experience with liquid cooling system design: rack manifolds, cold plates, quick-disconnect fittings, CDU integration
  • Experience with mechanical design of high-density interconnect systems (cable cartridges, blind-mate connectors, backplane assemblies)
  • Experience with high-power-density ML/AI accelerator or HPC thermal design
  • Track record of driving cost optimization through vendor strategy, second-sourcing, or design-for-manufacturing improvements
  • Familiarity with manufacturing processes: injection molding, sheet metal fabrication, die-casting, and CNC machining
  • Experience with shock, vibration, and structural qualification testing per ISTA, ASTM, or equivalent standards

Responsibilities

  • Own the complete thermal and mechanical design for ML/AI accelerator platforms from rack-level infrastructure down to chip packaging.
  • Define thermal and mechanical design requirements and establish design targets.
  • Deliver production platforms through the full lifecycle including concept, design, analysis, prototyping, validation, manufacturing ramp, and fleet operations.
  • Design and optimize cooling solutions for high-power-density ML/AI accelerators.
  • Develop detailed CFD models and structural FEA for thermal analysis and mechanical integrity.
  • Design rack manifolds, cold plates, and data center liquid cooling interfaces for at-scale deployments.
  • Develop and validate mechanical structures for manufacturability, reliability, and serviceability.
  • Perform structural FEA for shock, vibration, and transportation loads.
  • Participate in on-call rotations monitoring fleet thermal telemetry for emergent issues.
  • Perform root cause analysis of thermal and mechanical failures in production.
  • Drive design standardization and engage with ODMs and component suppliers.
  • Lead design reviews and mentor junior engineers.

Benefits

  • Employees at Amazon are often offered comprehensive health benefits—including multiple medical plan options (no pre-existing condition exclusions, 100% covered in-network preventive care), dental and vision plans, a 24/7 medical advice line from day one, expert second-opinion services, and broad mental-health support with several free counseling sessions (including pediatric). Financial wellness typically includes a 401(k) with company match (up to 2%), Restricted Stock Units (equity), FSAs, an emergency savings program, product and partner discounts, and even college-savings and home-purchase programs. Overall, the package is designed to support employees and their families’ health, finances, and day-to-day life.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Amazon Com Services Llc

As of Aug 23, 2026

Initial approvals

3,290

FY2026

Approval rate

99.1%

FY2026

LCA certified

32,937

FY2026

Entry-level share

10.6%

FY2026

Initial approvals YoY

+9%

Trend

LCA certified YoY

-44%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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