JobsNext-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
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Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer

Qualcomm

Location

San Diego, CA

Type

Full-time

Posted

8/6/2026

Compensation

$140,000 - $210,000 per year

Undergraduate with 5+ Years of Experience
Master's with 5+ Years of Experience
Approval 97.1%·Filings 1,170·New hires 255·
Established Sponsor
·FY 2025

Job description

The Senior ASIC Design Engineer will be part of the Next Generation, High-Speed Memory and Cache Controller and Advanced Memory NoCs based Subsystem Design Team at Qualcomm. This role focuses on the architecture, design, and deployment of high-speed memory subsystems for QCT products. The engineer will be responsible for enabling high-speed designs and will work closely with verification engineers to ensure high-quality outputs. Key tasks include debugging designs, synthesis, timing closure, and power analysis.

Requirements

  • Bachelor's or Master's degree in Science, Engineering, or a related field.
  • 5+ years of ASIC design, RTL coding, and front-end digital design experience.
  • 3+ years of Hardware Architecture experience.
  • Experience with LPDDR memory and cache controllers.
  • Exposure to HBM memory type designs.

Responsibilities

  • Develop architecture and design specifications for high-speed memory subsystems.
  • Implement and deliver RTL designs.
  • Collaborate with verification engineers to ensure design quality.
  • Debug designs and provide support during integration.
  • Contribute to the improvement of design methodology to enhance productivity and quality.

Benefits

  • Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.

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