This role at NVIDIA involves crafting and implementing silicon pad rings while collaborating with various engineering teams. The position emphasizes proactive ownership and innovative problem-solving in a dynamic work environment. Candidates will work on defining chip floor plans and electrical packages, contributing to the future of technology. NVIDIA values diversity and offers a supportive atmosphere for its employees.

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design.
• Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery, and signal integrity is desired.
• Programming and scripting skills in Perl, Python, Tcl are preferred.
• Familiarity with Cadence Skill and EXCEL is useful and a plus.
• Ability to work with a minimum of supervision.
• A desire to solve complex technical problems.

• Define and implement the chip pad ring and substrate interconnect scheme.
• Lead the package layout design process.
• Collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers.
• Define a chip floor plan, pad ring, substrate, and ball out to implement a robust world-class electrical package.
• Communicate effectively with various teams throughout the company.

• Employees at NVIDIA are often offered comprehensive, day-one benefits—including medical, dental, and vision coverage with HSA support, life and disability insurance, an Employee Assistance Program, and a 401(k) with auto-enrollment. Many roles also have generous time off and holidays, donation matching (up to $10,000), and a wide menu of extras like FSAs, commuter benefits, legal and identity-theft protection, pet insurance, and wellness discounts. Optional programs can include student-loan and home-purchase support, plus family care resources and expert medical services.