Microelectronic Packaging Collateral Engineers focus on project management and the design and development of equipment collateral for integrated circuit and semiconductor assemblies. They are responsible for ensuring package performance and specifications through rigorous testing and material specification. The role involves collaboration with various teams, including Quality Assurance and Purchasing, to maintain material quality. This position requires a blend of technical expertise and problem-solving skills to address packaging challenges.

• Candidate must possess a bachelor's degree in mechanical engineering or related STEM field.
• 6+ months of experience in mechanical design, CAD/SolidWorks, or related areas.
• Experience with geometric dimensioning and finite element analysis.

• Responsible for the thermal, mechanical, and electrical design of collaterals.
• Defines overall package performance and specifications.
• Conducts tests and research on basic materials and properties.
• Establishes material specifications for contract assemblers and raw material vendors.
• Provides consultation concerning packaging problems and improvements.
• Responds to customer/client requests as they occur.
• Develops solutions to problems utilizing formal education and engineering judgment.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.