The Module Packaging Media Engineer role focuses on project management, media design, and development for integrated circuit and semiconductor assemblies. The engineer will work on thermal, mechanical, and electrical design while ensuring package performance and specifications are met. This position requires collaboration with various teams, including Quality Assurance and Purchasing, to maintain material quality. The ideal candidate will leverage their engineering judgment to develop solutions to packaging challenges.

• Bachelor's degree in mechanical engineering or related STEM field and 4+ years of experience, or a Master's degree with 2+ years of experience.
• Experience in Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Element Analysis.
• Full cycle project management experience.

• Responsible for the thermal, mechanical, and electrical design, analysis, and development of media.
• Define overall package performance and specification and realize technology certification through qualification plans and data collection.
• Conduct tests and research on basic materials and properties.
• Establish material specifications for contract assemblers and raw material vendors.
• Provide consultation concerning packaging problems and improvements in the packaging process.
• Respond to customer/client requests or events as they occur.
• Develop solutions to problems utilizing formal education and engineering judgment.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.