JobsPackaging module development engineer
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Packaging module development engineer

Intel

Location

Phoenix, AZ

Type

Full-time

Posted

8/11/2026

Compensation

$99,030 - $188,890 per year

Undergraduate with 2+ Years of Experience
Approval 96.6%·Filings 2,117·New hires 632·
💎 Strong Sponsor
·FY 2025

Job description

Join Intel's Advanced Packaging Technology Development team as a Packaging Module Development Engineer, where you will develop and optimize substrate processes and equipment for future packaging platforms. This role involves collaboration with cross-functional teams to address complex challenges and innovate in a fast-paced environment. You will contribute to the manufacturability and reliability of next-generation products, focusing on quality, cost, yield, and productivity. This position offers the opportunity to be part of a world-class embedded die packaging facility and drive disruptive technology innovations.

Requirements

  • Bachelor’s degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management, or related engineering degree plus 2+ years of experience.
  • Master's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management, or related engineering degree.
  • Experience in packaging module development.
  • Experience in process equipment design, install, and qualification.
  • Experience defining and establishing equipment configurations, process specifications, and integrated process flow for new process technologies.

Responsibilities

  • Develop and optimize cutting-edge substrate processes and equipment.
  • Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies.
  • Plan and conduct comprehensive DOEs to fundamentally characterize process windows and understand process, equipment, materials, and chemistry interactions.
  • Drive continuous process improvements on process capability, stability, quality, reliability, cost, yield, automation, and productivity.
  • Lead and participate in cross-functional and cross-organizational teams that support substrate technology development.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

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