JobsNext-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
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Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer

Qualcomm

Location

San Diego, CA

Type

Full-time

Posted

8/18/2026

Compensation

$140,000 - $210,000 per year

Undergraduate with 5+ Years of Experience
Master's with 5+ Years of Experience
Approval 97.1%·Filings 1,170·New hires 255·
Established Sponsor
·FY 2025

Job description

Qualcomm Technologies, Inc. is seeking a Senior ASIC Design Engineer to join their Next Generation, High-Speed Memory and Cache Controller team. This role focuses on the design and deployment of high-speed memory subsystems, including HBM, LPDDR, and DDR technologies. The engineer will work closely with various system components such as CPUs and GPUs to enable high-speed designs. Responsibilities include architecture development, RTL coding, and collaboration with verification engineers to ensure high-quality designs.

Requirements

  • Bachelor's or Master's degree in Science, Engineering, or a related field.
  • 5+ years of ASIC design, RTL coding, and front-end digital design experience.
  • 3+ years of Hardware Architecture experience.
  • Experience with LPDDR memory and cache controllers.
  • Exposure to HBM memory type designs.

Responsibilities

  • Develop architecture and design specifications for high-speed memory subsystems.
  • Implement and deliver RTL designs while collaborating with verification engineers.
  • Debug designs and provide support during integration into the chip.
  • Conduct synthesis, timing closure, and power analysis tasks.
  • Contribute to improvements in design methodology to enhance productivity and quality.

Benefits

  • Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.

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