JobsNext-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
QualcommNext-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
QualcommLocation
San Diego, CA
Type
Full-time
Posted
8/18/2026
Compensation
$140,000 - $210,000 per year
Undergraduate with 5+ Years of Experience
Master's with 5+ Years of Experience
Approval 97.1%·Filings 1,170·New hires 255·
✓ Established Sponsor
·FY 2025Job description
Qualcomm Technologies, Inc. is seeking a Senior ASIC Design Engineer to join their Next Generation, High-Speed Memory and Cache Controller team. This role focuses on the design and deployment of high-speed memory subsystems, including HBM, LPDDR, and DDR technologies. The engineer will work closely with various system components such as CPUs and GPUs to enable high-speed designs. Responsibilities include architecture development, RTL coding, and collaboration with verification engineers to ensure high-quality designs.
Requirements
- Bachelor's or Master's degree in Science, Engineering, or a related field.
- 5+ years of ASIC design, RTL coding, and front-end digital design experience.
- 3+ years of Hardware Architecture experience.
- Experience with LPDDR memory and cache controllers.
- Exposure to HBM memory type designs.
Responsibilities
- Develop architecture and design specifications for high-speed memory subsystems.
- Implement and deliver RTL designs while collaborating with verification engineers.
- Debug designs and provide support during integration into the chip.
- Conduct synthesis, timing closure, and power analysis tasks.
- Contribute to improvements in design methodology to enhance productivity and quality.
Benefits
- Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.
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