JobsStaff Failure Analysis Engineer - Advanced Packaging Technologies
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Staff Failure Analysis Engineer - Advanced Packaging Technologies

Qualcomm

Location

San Diego, CA

Type

Full-time

Posted

8/18/2026

Compensation

$134,800 - $202,200 per year

Undergraduate with 5+ Years of Experience
Master's with 2+ Years of Experience
PhD Entry-Level
H-1B FY202698.1% approval-22% YoY
👑 Elite sponsor

Job description

Qualcomm Technologies, Inc. is seeking a highly skilled Failure Analysis Engineer to lead the development of FA test interfaces and thermal management solutions. This role is crucial for enabling design debug, yield improvement, and RMA analysis across Qualcomm's diverse product portfolio. The successful candidate will innovate hardware methodologies to ensure robust fault isolation capabilities for next-generation products. The position involves collaboration with various teams to align FA hardware capabilities with evolving product requirements.

Requirements

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
  • Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
  • PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Responsibilities

  • Lead FA test interface enablement across all Qualcomm product lines.
  • Proactively plan, develop, and deploy FA-specific hardware such as custom sockets and carrier boards.
  • Define and optimize the minimum viable set of socket and interface variants required for comprehensive FA test scenarios.
  • Design, evaluate, and deploy thermal management solutions tailored to FA use cases for high-power devices.
  • Utilize thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions.
  • Develop detailed hardware specifications and collaborate with internal teams and external suppliers.
  • Partner with cross-functional teams to align FA hardware capabilities with evolving product requirements.
  • Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.

Benefits

  • Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Qualcomm Technologies Inc

As of Aug 23, 2026

Initial approvals

198

FY2026

Approval rate

98.1%

FY2026

LCA certified

59,278

FY2026

Entry-level share

0.0%

FY2026

Initial approvals YoY

-22%

Trend

LCA certified YoY

+30%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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