This role at NVIDIA focuses on defining and implementing chip pad rings and substrate interconnect schemes within a dynamic team environment. The position requires proactive ownership and collaboration with various engineering teams to drive technology across multiple functions. Candidates will have the opportunity to work on complex package design and contribute to innovative solutions in the field. NVIDIA values diversity and fosters an inclusive workplace, encouraging talented individuals to make a lasting impact.

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design.
• Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery, and signal integrity is desired.
• Programming and scripting skills in Perl, Python, Tcl are desired.
• Familiarity with Cadence Skill and EXCEL is useful and a plus.
• Ability to work with a minimum of supervision.
• A strong desire to solve complex technical problems.

• Define and implement the chip pad ring and substrate interconnect scheme.
• Lead the package layout design process.
• Collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers.
• Define a chip floor plan, pad ring, substrate, and ball out to implement a robust world-class electrical package.
• Communicate effectively with various teams throughout the company.

• Employees at NVIDIA are often offered comprehensive, day-one benefits—including medical, dental, and vision coverage with HSA support, life and disability insurance, an Employee Assistance Program, and a 401(k) with auto-enrollment. Many roles also have generous time off and holidays, donation matching (up to $10,000), and a wide menu of extras like FSAs, commuter benefits, legal and identity-theft protection, pet insurance, and wellness discounts. Optional programs can include student-loan and home-purchase support, plus family care resources and expert medical services.