The Packaging Module Development Engineer at Intel will play a crucial role in advancing assembly packaging technologies that drive the company's future innovations. This position is part of the Packaging Module Development team, which focuses on optimizing manufacturing processes and enhancing product reliability. The engineer will contribute to the development of next-generation packaging solutions and ensure manufacturing efficiency. This role is essential for maintaining Intel's leadership in the global semiconductor industry.

• US Citizenship
• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience, or a Master's degree with 1+ years of relevant experience, or a PhD in a related field.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
• Apply Design of Experiments (DOE) principles and statistical methods to refine processes and document findings.
• Ensure manufacturability of physical layouts in package designs and oversee manufacturing equipment health.
• Support integration of new materials and architectures into manufacturing equipment.
• Innovate new techniques and tools to identify and address equipment health and reliability issues.
• Lead problem-solving initiatives and continuous improvement efforts for processes and equipment.
• Standardize equipment qualification practices and manufacturing quality systems.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.