The Research Scientist role at IBM focuses on the development of advanced RF and mixed-signal packaging solutions for high-performance applications, particularly in quantum computing. The position involves collaboration with scientists and engineers to create innovative solutions that address complex communication and computation challenges. Candidates will engage in hands-on design and testing, contributing to projects from concept to implementation. This role is part of IBM Quantum, which is dedicated to pioneering new technologies in the field of computing.

• Master's degree in a relevant field is required, with a doctorate preferred.
• Strong background in RF/microwave engineering is essential.
• Familiarity with state-of-the-art packaging technologies is necessary.
• Experience with EM simulation and SI/PI analysis tools such as HFSS, ADS, or Cadence Allegro is required.
• Demonstrated expertise in RF and mixed-signal packaging solutions with at least 2 years of experience.

• Contribute to the design and development of RF and mixed-signal single-chip and multi-chip modules.
• Design packages that support RFICs and high-speed digital interfaces.
• Conduct EM simulation and package-IC co-simulation.
• Collaborate closely with IC and system designers throughout the design process.
• Engage in hands-on lab work for testing and characterization of packaging solutions.

• IBM offers competitive compensation, healthcare coverage, retirement programs, paid parental leave, tuition assistance, wellness programs, flexible work options, and extensive learning and certification resources.