This role focuses on developing and optimizing assembly processes and equipment for Intel's future packaging technologies. The position requires regular onsite presence and involves collaboration with various teams to ensure quality and reliability in manufacturing. The successful candidate will apply innovative solutions and statistical methods to improve processes and address packaging challenges. This role also includes establishing material specifications and ensuring compliance with vendor performance requirements.

• Bachelor's in mechanical engineering, Material Engineering, Electrical Engineering, Physics, or a master's in a related technical discipline.
• Minimum 6 months of experience in fundamental science and engineering concepts, including knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• This position is not open to Intel immigration sponsorship.

• Develop assembly processes and equipment to support Intel's packaging platform technologies.
• Optimize manufacturing efficiency by developing processes that meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Document improvements through white papers and maintain equipment for evaluating silicon and package technologies.
• Establish material specifications for contract assemblers and ensure adherence to process specifications.
• Develop new techniques and tools for early identification of packaging quality issues.
• Provide consultation on packaging problems and improvements in the packaging process.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.