As a Qualcomm Package System Design and Technology Engineer, you will focus on advanced package technology development and system design analysis. You will collaborate with multi-disciplinary teams to optimize mechanical, electrical, and thermal package systems for various applications. The role involves performing signal and power integrity tasks and working closely with package and IC designers. You will also be responsible for electrical model extraction and system-level simulation, ensuring high performance and reliability in product designs.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• 8+ years of experience in DDR in Package/PCB/System Design related to compute/server standards.
• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, and SPICE transient simulation including use of IBIS and IBIS AMI models.

• Drive new advanced package technology development and concept design architecture analysis.
• Perform various IO analyses using established methodologies from model extraction through simulation.
• Analyze IO power distribution in product development and reference systems.
• Perform package extraction for time domain and frequency domain analysis.
• Create clear and complete documentation of results.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.