JobsPrincipal Chipset Project Engineer – Hardware PCB/Platform Systems for Personal Compute (PC)
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Principal Chipset Project Engineer – Hardware PCB/Platform Systems for Personal Compute (PC)

Qualcomm

Location

San Diego, CA

Type

Full-time

Posted

8/26/2026

Compensation

$192,600 - $289,000 per year

Undergraduate with 5+ Years of Experience
H-1B FY202698.1% approval-22% YoY
👑 Elite sponsor

Job description

The Principal Chipset Project Engineer – Hardware PCB/Platform Systems at Qualcomm will lead the Platform/PCB strategy for the Personal Compute product portfolio. This role involves defining PCB and hardware platform architecture while driving cost-optimized system decisions. The engineer will work closely with various teams to ensure that aggressive targets for cost, area, power, and performance are met. This leadership position is crucial for influencing platform direction and engaging with vendors and OEMs to enable competitive PC platforms.

Requirements

  • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience, or a Master's degree with 7+ years, or a PhD with 6+ years.
  • 12+ years of experience in hardware platform architecture and PCB design focused on the personal computer segment.
  • Strong understanding of PCB architecture fundamentals, including layer drivers and stack-up trade-offs.
  • Knowledge of power delivery networks, signal integrity, and power integrity.
  • Proven track record of making early architectural decisions that impact platform cost and manufacturability.
  • Strong communication skills with experience interfacing with senior executives and cross-functional teams.

Responsibilities

  • Lead early PCB architectural trade-off decisions and articulate cost, power, performance, and risk implications.
  • Set, execute, and own targets for PCB cost, area, and bill of materials while maintaining performance.
  • Drive PCB competitiveness across platforms by minimizing layer count and enhancing routing efficiency.
  • Provide cross-functional leadership and establish partnerships across various engineering teams.
  • Engage with vendors, OEMs, and ODMs to align on platform and PCB architecture.
  • Establish best practices for cost-driven platform and PCB architecture to enable scalable execution.
  • Influence future chipset and platform roadmaps using execution experience and competitive analysis.

Benefits

  • Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Qualcomm Technologies Inc

As of Aug 23, 2026

Initial approvals

198

FY2026

Approval rate

98.1%

FY2026

LCA certified

59,278

FY2026

Entry-level share

0.0%

FY2026

Initial approvals YoY

-22%

Trend

LCA certified YoY

+30%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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