The Qualcomm Custom Memory Team is seeking a candidate for a role focused on 3D Memory Design and Architecture for memory-centric compute systems. The position involves optimizing 3D Memory architectures to enhance system performance metrics such as bandwidth and power efficiency. The candidate will collaborate with various teams, including AI and compute architects, to ensure effective integration of memory and compute blocks. This role is crucial in advancing Qualcomm's innovative edge AI and connected computing technologies.

• Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design experience, or a Master's degree with 7+ years, or a PhD with 6+ years.
• Experience in RTL, circuit and system design to model and optimize dataflow.
• Knowledge of chip connection fabrics such as UCIe, UAL, LPDDR, HBM3/4, and PCIe.
• Proficiency in programming languages such as C/C++ or scripting languages like Perl/Python.
• Familiarity with DRAM/FLASH datasheets and IO interfaces.

• Develop and optimize 3D DRAM/FLASH organization and near-memory computing architectures.
• Validate models for 3D Memory performance, power, and yield based on various design choices.
• Create novel fabrics for efficient distribution of high-bandwidth data from 3D DRAM to computing units.
• Simulate and emulate system performance of 3D memory architectures across different workloads.
• Floorplan 3D memory chips and design control structures under manufacturing constraints.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.