Job description
The role involves working within Qualcomm's Central Baseband Hardware Systems organization, focusing on the development of baseband and embedded system reference designs. The team emphasizes the co-design of silicon, package, and PCB interconnect technologies for Qualcomm application processors and power management ASICs. The position requires collaboration with cross-functional teams to define system requirements and develop platform architectures for various mobile and computing products. The engineer will also engage in high-speed digital hardware design and integration into consumer product form factors.
Requirements
- Bachelor's degree in Engineering or related field.
- Board-level hardware design experience involving CPU-based platforms, consumer electronics, mobile devices, AR/VR products, wearables, compute devices, and/or low-power systems.
- Digital/baseband and analog circuit design experience.
- Experience with signal integrity and power integrity tools and methodologies.
- Proficiency with PCB schematic capture and layout tools such as Xpedition and/or Allegro.
- Strong problem-solving, communication, and cross-functional collaboration skills.
Responsibilities
- Define system and reference design requirements in collaboration with cross-functional and geographically distributed teams.
- Develop and document platform architectures for mobile, AR/VR, wearable, laptop, tablet, and compute products based on Qualcomm SoCs, ASICs, and PMICs.
- Design and implement high-speed digital/baseband hardware, including schematic capture, BOM development, PCB/PWB layout support, and stackup definition.
- Perform signal integrity and power integrity analysis, simulation, and optimization for high-speed interfaces, memory subsystems, and power delivery networks.
- Design and integrate high-speed interfaces including PCIe, USB, Ethernet, SPI, and I2C.
- Support electrical and mechanical integration of hardware into consumer product form factors.
- Collaborate with silicon, package, systems, CAD, and customer engineering teams to drive successful platform development.
- Provide technical leadership and direct engagement with ODM partners throughout reference design development and production.
- Conduct design reviews, develop design guidelines, and provide feedback on ODM-manufactured designs.
- Apply DFT, DFM, and high-volume manufacturing best practices throughout the design process.
- Quickly assimilate into existing projects, interpret technical requirements, and solve complex hardware design challenges.
Benefits
- Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.
H-1B filing history
Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026
Filing entity: Qualcomm Technologies Inc
As of Jul 17, 2026
Initial approvals
198
FY2026
Approval rate
98.1%
FY2026
LCA certified
59,278
FY2026
Entry-level share
0.0%
FY2026
Initial approvals YoY
-22%
Trend
LCA certified YoY
+30%
Trend
Initial approvals by fiscal year
Approval rate by fiscal year
Continuing vs initial approvals
LCA certified positions by quarter
LCA certified positions by fiscal year
Based on public USCIS and DOL filings; not a sponsorship guarantee.
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