The candidate will work in a collaborative engineering environment at Qualcomm, focusing on signal and power integrity tasks. This role involves partnering with package, platform, and IC designers to optimize package and system designs. The candidate will support high-speed SerDes electrical model extraction and system-level simulation for high-speed computing and server projects. Effective collaboration with board, package, and IC design teams across organizational boundaries is essential.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• 10+ years of experience with high-speed SerDes package, PCB, or system design for computing/server standards.

• Perform IO analysis using established methodologies, including model extraction, simulation, and reporting.
• Analyze IO power distribution for product development and reference systems using established methodologies.
• Perform package extraction for time- and frequency-domain analysis and provide package design guidelines.
• Document results clearly and thoroughly.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.