Annapurna Labs is seeking a Sr. Signal & Power Integrity Engineer to join their hardware team, focusing on the SI/PI analysis and optimization of advanced packaging solutions for machine learning and data center ASICs. The role involves owning the package-level signal and power integrity strategy from architecture trade-offs to design closure and validation. The team values knowledge-sharing and mentorship, fostering an inclusive culture that supports diverse experiences. This position offers opportunities for career growth while ensuring work-life balance.

• Bachelor's degree in Electrical Engineering or a related field
• 10+ years of experience in signal integrity, power integrity, and package design
• Deep expertise in package SI/PI analysis including S-parameter extraction and IR drop analysis
• Hands-on experience with EM simulation and SI/PI tools such as HFSS and Cadence Sigrity
• Strong understanding of advanced packaging technologies like 2.5D/3D-IC and silicon interposers
• Experience analyzing and modeling decoupling technologies within the package PDN
• Proficiency in stack-up design and impedance control for multi-layer organic substrates

• Lead package-level SI/PI analysis for advanced architectures such as 2.5D and 3D-IC.
• Design and optimize package stack-ups for high-speed and power delivery performance.
• Perform high-speed channel simulations for die-to-die and die-to-board interfaces.
• Analyze and optimize the package PDN end-to-end, including decoupling strategy and IR drop.
• Characterize and model on-die capacitance and evaluate their effectiveness within the PDN.
• Interface with SoC die-level PDN teams to align power grid requirements across the chip-package boundary.
• Perform 3D/2.5D EMIR analysis to validate IR drop and electromigration across multi-die packages.
• Model advanced interconnects for both signal and power paths.
• Apply equalization techniques and evaluate package-level channel margins for various protocols.
• Perform clock distribution and jitter analysis at the package level.
• Collaborate with ASIC design, board design, and packaging teams to optimize package architecture.
• Identify and mitigate package manufacturing risks related to SI/PI.
• Develop and maintain package SI/PI modeling flows and design guidelines.

• Employees at Amazon are often offered comprehensive health benefits—including multiple medical plan options (no pre-existing condition exclusions, 100% covered in-network preventive care), dental and vision plans, a 24/7 medical advice line from day one, expert second-opinion services, and broad mental-health support with several free counseling sessions (including pediatric). Financial wellness typically includes a 401(k) with company match (up to 2%), Restricted Stock Units (equity), FSAs, an emergency savings program, product and partner discounts, and even college-savings and home-purchase programs. Overall, the package is designed to support employees and their families’ health, finances, and day-to-day life.