As a Module Engineering Intern at Intel's F25 Metals organization, you will collaborate with engineers and operations teams to support high-volume manufacturing of semiconductor technologies. This internship provides hands-on experience in semiconductor manufacturing while addressing real-world engineering challenges. Interns will lead projects focused on process improvement and operational excellence, while also engaging in day-to-day engineering activities. You will gain insights into manufacturing workflows and develop technical communication skills.

• Currently pursuing a PhD degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
• Minimum GPA of 3.0.
• Academic coursework or research experience in semiconductor processing, materials science, microelectronics, or a closely related field.
• Availability to participate in a minimum 10 to 12-week summer internship.
• 3+ months of educational, research, laboratory, internship, or industry experience.
• Ability to work onsite in Hillsboro, Oregon.

• Lead a project from problem definition through execution and final presentation.
• Analyze manufacturing, equipment, and operational data to support decision making.
• Apply structured problem-solving and continuous improvement methodologies.
• Collaborate with engineers, technicians, quality teams, and operational stakeholders.
• Develop technical communication and presentation skills.
• Gain exposure to advanced semiconductor manufacturing technologies and operations.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.