The Packaging Module Development Engineer focuses on developing assembly processes and equipment to support Intel's future packaging technologies. This role involves optimizing manufacturing efficiency while ensuring quality and reliability standards are met. The engineer will also develop specifications and maintain equipment for evaluating silicon and package technologies. Collaboration with suppliers and internal teams is essential to ensure material quality and adherence to process specifications.

• PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 1+ years of experience.
• 1+ years of experience applying statistical analysis techniques including Design of Experiments (DOE) and Statistical Process Control (SPC).
• 1+ years of experience with process development, characterization, optimization, or qualification in semiconductor manufacturing or related advanced technology environments.
• Minimum cumulative GPA of 3.5.

• Develop assembly processes and equipment for innovative packaging solutions.
• Optimize manufacturing efficiency while meeting quality, reliability, and cost requirements.
• Establish material specifications and interface with supplier quality and procurement teams.
• Develop new techniques and tools for early identification of packaging quality issues.
• Lead efforts in innovating and improving equipment and processes using statistical methods.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.