The Senior Package Modeling Engineer role at NVIDIA's Advanced Technology Group focuses on enhancing the reliability and performance of advanced semiconductor packaging. The position involves conducting Finite Element Analysis to evaluate stress and thermo-mechanical behavior. Candidates will work in a collaborative environment, contributing to the development of packaging technology and mentoring others. This opportunity allows for significant impact on the future of semiconductor packaging.

• MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or a related field.
• 5+ years of FEA modeling/simulation experience.
• Strong expertise in FEA tools such as ANSYS, Abaqus, or COMSOL.
• Knowledge of thermal-mechanical interactions and reliability failure modes.
• Familiarity with JEDEC reliability standards and accelerated life testing.
• Practical understanding of advanced semiconductor packaging architecture and materials.

• Conduct Finite Element Analysis to assess stress, warpage, and thermo-mechanical behavior.
• Contribute to packaging technology direction and long-term roadmaps.
• Analyze material properties and their impact on package reliability.
• Establish modeling approaches and assumptions and interpret simulation results.
• Collaborate with cross-functional teams to ensure robust package builds.
• Document modeling methodologies and present findings to collaborators.

• Employees at NVIDIA are often offered comprehensive, day-one benefits—including medical, dental, and vision coverage with HSA support, life and disability insurance, an Employee Assistance Program, and a 401(k) with auto-enrollment. Many roles also have generous time off and holidays, donation matching (up to $10,000), and a wide menu of extras like FSAs, commuter benefits, legal and identity-theft protection, pet insurance, and wellness discounts. Optional programs can include student-loan and home-purchase support, plus family care resources and expert medical services.