The Substrate Quality and Reliability Engineer role at Intel focuses on driving substrate capacity expansion and influencing key technology decisions during the TD and ramp phases. The engineer will enable qualification plans and strategies to meet product milestones while addressing manufacturing challenges at substrate factories. This position requires regular onsite presence and collaboration with cross-functional teams to ensure product quality and reliability. The ideal candidate will thrive in a dynamic environment and tackle complex technical challenges.

• Master's degree with 2+ years of industry experience or PhD degree in a related engineering discipline.
• 2+ years of experience in substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration.
• Demonstrated ability to collaborate across cross-functional teams.
• 1+ years of experience in empirical data collection and statistical data analysis.

• Develop, apply, and maintain quality and reliability standards for substrate packaging components.
• Define inspection, screening, and testing mechanisms to mitigate yield and reliability risks.
• Determine reliability requirements to achieve reliability objectives.
• Develop reliability models by performing statistical analysis to categorize reliability risk.
• Deliver standardization in product qualification and manufacturing quality systems.
• Influence and engage with packaging technology development and partner engineering teams.
• Develop new acceleration techniques and analytical tools for early problem identification.
• Respond to customer requests or quality events as they occur.
• Make proactive recommendations for changes to improve product quality and reliability.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.