Join Intel's Advanced Packaging team as a Senior Technical Leader focused on driving process innovation in semiconductor packaging technologies. This role involves leading the development and optimization of thin-film deposition processes to ensure successful transitions from technology development to high-volume production. The team plays a crucial role in enabling next-generation packaging technologies while meeting customer and business requirements. You will collaborate with various engineering disciplines to solve complex manufacturing challenges and influence long-term technology direction.

• Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field with 8+ years of semiconductor industry experience, or a Bachelor's degree with 10+ years of experience focused on thin-film process engineering.
• Demonstrated success in process development, manufacturing engineering, and technical leadership roles.
• Experience collaborating with leading semiconductor equipment suppliers on process and equipment optimization.
• Strong knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), and manufacturing automation systems.
• Proven ability to solve complex technical challenges in a high-volume manufacturing environment.

• Champion safety, quality, yield, throughput, and cost optimization across thin-film deposition processes.
• Drive defect reduction, process capability improvements, and film uniformity enhancements through systematic process optimization.
• Lead technical problem-solving efforts and deliver innovative solutions that achieve aggressive technology node targets.
• Optimize equipment performance in partnership with internal stakeholders and key equipment suppliers.
• Develop and implement robust process controls to ensure manufacturing stability and scalability.
• Align technical strategies with customer requirements, product roadmaps, and business objectives.
• Analyze complex technical data and translate insights into actionable manufacturing solutions.
• Own end-to-end resolution of critical manufacturing challenges across multiple engineering disciplines.
• Accelerate technology development and production readiness by executing innovative solutions against demanding schedules.
• Influence long-term technology direction through technical expertise and strategic decision-making.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.