This position involves driving the end-to-end development of substrate design, focusing on physical layout and routing of package designs. The role requires collaboration with silicon and hardware teams to optimize performance and pinout. The engineer will define design rules, conduct reviews, and resolve design rule checks to enhance package design. Additionally, documentation and management of the product lifecycle are key aspects of this role.

• Ph.D. or master's degree in electrical engineering, chemical engineering, mechanical engineering, or material science.
• 10+ years of experience in package, PCB design, or IC digital design.
• Strong technical background in design and electrical analysis.
• Solid background in semiconductor fabrication and packaging.
• Experience with design and electromagnetic simulation tools such as Mentor and Cadence tools.

• Drive end-to-end development for substrate design from concept through tape out.
• Implement physical layout and routing of package designs.
• Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs.
• Work closely with silicon and hardware teams to optimize silicon-package-board performance.
• Define substrate design rules and conduct internal and external reviews.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.