The Semiconductor Packaging Integration Research Manager leads advanced packaging integration research to enable next-generation heterogeneous semiconductor technology and systems. This role is part of the Foundry Technology Research team, which focuses on developing breakthrough technologies for semiconductor manufacturing. The manager will define integration strategies and guide exploratory concepts from research to development. Collaboration with various teams and external partners is essential to close integration gaps and drive innovative solutions.

• Master’s degree in electrical engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Applied Physics, Microelectronics, Semiconductor Manufacturing, or a related engineering or science discipline; Ph.D. preferred.
• Minimum of 7 years of experience in semiconductor technology roles, preferably in packaging integration or advanced packaging research.
• Demonstrated experience leading advanced technology research programs and multidisciplinary technical teams.
• Strong understanding of package-system integration and advanced interconnects.

• Lead packaging integration research programs focused on heterogeneous integration and emerging interconnect technologies.
• Define integration research strategy and technical roadmaps aligned to future product requirements.
• Manage a multidisciplinary team of integration researchers and technical program leads.
• Translate system requirements into package integration solutions by balancing various performance factors.
• Drive feasibility studies and experimental validation for new integration concepts.
• Communicate technical progress and strategic recommendations to senior leaders.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.