The Summer Intern 2027 position in Assembly Technology Development at Intel focuses on materials technology development. As a Module Engineering Graduate Intern, you will engage in fundamental research and experimentation to understand materials and their applications. You will work closely with materials suppliers and collaborate with various teams to implement material technologies. This role emphasizes innovation in assembly processes and equipment to support next-generation packaging technologies.

• The candidate must be a full-time student pursuing a Ph.D. degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Science or Polymer Chemistry, Metallurgy, or related technical fields.
• 6+ months to 1+ years of relevant experience in fundamental research and experimentation.

• Conduct fundamental research and experimentation to characterize materials and identify potential failure modes.
• Collaborate closely with materials suppliers to develop and source material formulations.
• Develop a comprehensive understanding of Intel's assembly processes and material interactions.
• Partner with Equipment and Process Engineering teams to implement material technologies on test vehicles and products.
• Design and develop assembly processes and equipment using innovative concepts and solutions.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.