JobsPackaging Module Development Engineer
Intel logo

Packaging Module Development Engineer

Intel

Location

Phoenix, AZ

Type

Full-time

Posted

9/17/2026

Compensation

$133,800 - $188,890 per year

Undergraduate Entry-Level
Master's Entry-Level
PhD Entry-Level
H-1B FY202694.2% approval-88% YoY
💎 Strong sponsor

Job description

The Packaging Module Development Engineer role at Intel focuses on semiconductor packaging innovation within the Advanced Packaging Technology & Manufacturing team in Chandler, Arizona. This position involves designing, optimizing, and qualifying assembly processes and equipment for Intel's advanced products. The engineer will work on technologies that support mobile devices and high-performance computing systems. This is an entry-level position that offers the opportunity to make a significant impact in the semiconductor industry.

Requirements

  • Bachelor’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience.
  • Master’s degree in engineering, Physics, Chemistry, or a related STEM field with 6+ months of relevant industry experience.
  • PhD in Engineering, Physics, Chemistry, or a related STEM field.
  • Experience with Statistical Process Control (SPC) and Design of Experiments (DOE).
  • Hands-on experience with process development, equipment qualification, and characterization in a packaging or manufacturing environment.

Responsibilities

  • Develop, optimize, and qualify packaging assembly processes and equipment to meet quality, reliability, yield, and cost targets.
  • Lead experimental design and process characterization using Design of Experiments (DOE) and Statistical Process Control (SPC) methodologies.
  • Innovate new techniques, materials, and tools to address challenges in packaging quality and reliability.
  • Collaborate with cross-functional teams to identify and mitigate technical risks.
  • Establish and maintain specifications for materials and equipment, partnering with suppliers.
  • Provide technical consultation and support for packaging challenges in development and manufacturing.
  • Document technical findings, process improvements, and experimental results.
  • Drive standardization in manufacturing systems, equipment setups, and process flows across Intel sites.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Intel Corp

As of Aug 23, 2026

Initial approvals

74

FY2026

Approval rate

94.2%

FY2026

LCA certified

2,201

FY2026

Entry-level share

0.1%

FY2026

Initial approvals YoY

-88%

Trend

LCA certified YoY

-54%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

Is this posting expired or inaccurate?