Intel's Substrate Packaging Technology Development organization is seeking a Packaging Module Development Engineer to join their Arizona team. This role focuses on developing advanced packaging processes and equipment for next-generation semiconductor technologies. The engineer will work on heterogeneous integration and die disaggregation solutions, contributing to Intel's product roadmap. This position offers the opportunity to collaborate with world-class engineers and influence the future of semiconductor packaging.

• PhD in a relevant STEM field
• 6+ months of experience in Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies
• Experience in packaging process development and equipment qualification
• Solid knowledge of equipment setup, calibration, and performance evaluation in manufacturing environments
• Familiarity with semiconductor device fabrication and packaging process flows
• Experience managing complex technical projects with a focus on innovation and optimization
• Knowledge of quality systems, process documentation, and manufacturing standards

• Develop and qualify advanced packaging processes, materials, and equipment to meet reliability, yield, and cost targets.
• Design and implement process specifications, prototype workflows, and equipment configurations for emerging packaging technologies.
• Conduct Design of Experiments (DOE) to analyze process windows and understand interactions between materials, equipment, and chemistry.
• Drive continuous process improvements to enhance capability, stability, quality, and overall productivity.
• Collaborate with cross-functional teams to resolve complex technical challenges and deliver impactful solutions.
• Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards.
• Document technical findings and process innovations through detailed reports and technical papers.
• Support standardization of manufacturing systems and qualification procedures to ensure consistency and scalability.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing settings.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.