Job description
The Chemical Mechanical Planarization (CMP) Process Development Engineer at Intel will focus on developing and sustaining planarization techniques for various materials and architectures in the semiconductor industry. This role is part of the Logic Technology Development (LTD) organization, which aims to meet the challenges of Moore's Law through innovative fabrication processes. The position requires collaboration across diverse scientific backgrounds to enable rapid miniaturization and mass production of integrated circuits. Engineers will drive technology development and provide solutions for high volume manufacturing.
Requirements
- PhD degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM field with a focus on hands-on experimental research.
- Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles, and engineering analysis tools.
- Experimental lab work experience.
- Knowledge of semiconductor and transistor device physics.
- Familiarity with advanced transistor device structures and architectures including fabrication techniques.
- Data analysis skills with the ability to construct clear data-based problem statements.
- Understanding of semiconductor processing fundamentals.
- Experience with materials and physical device characterization techniques.
Responsibilities
- Drive technology development and enablement for high volume manufacturing and future technology.
- Lead design and development of sophisticated manufacturing processes and repair reverse engineering.
- Perform pathfinding activities in support of process and hardware development.
- Recommend and implement modifications for operating equipment to improve production efficiency.
- Partner with key equipment and materials suppliers to develop enabling elements of technology.
- Perform process technology feasibility studies through theoretical simulations and practical engineering methods.
- Stay updated on relevant industrial process and material manufacturing trends.
Benefits
- Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.
H-1B filing history
Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026
Filing entity: Intel Corp
As of Aug 23, 2026
Initial approvals
74
FY2026
Approval rate
94.2%
FY2026
LCA certified
2,201
FY2026
Entry-level share
0.1%
FY2026
Initial approvals YoY
-88%
Trend
LCA certified YoY
-54%
Trend
Initial approvals by fiscal year
Approval rate by fiscal year
Continuing vs initial approvals
LCA certified positions by quarter
LCA certified positions by fiscal year
Based on public USCIS and DOL filings; not a sponsorship guarantee.
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