The Qualcomm Mechanical Engineering Intern role offers an opportunity to work alongside leading engineers in designing, simulating, and testing mechanical and thermal systems that support advanced semiconductor technologies. Interns will engage in projects related to IC packaging, thermal modeling, and next-generation cooling solutions. This position is part of Qualcomm's commitment to engineering human progress through innovative technology. Interns will gain real-world experience and contribute to projects that shape the future of technology.

• Currently enrolled in a bachelor's, master's, or Ph.D. degree program in mechanical engineering, materials science, or a related field.
• Must be available for 11–14 weeks during Summer 2027 (May–September).
• Expected graduation date of November 2027 or later.
• 1+ years of academic experience with programming languages such as Python and Matlab.

• Contribute to the design, simulation, and testing of mechanical and thermal systems.
• Work on projects related to IC packaging, chip/package co-design, and thermal modeling.
• Collaborate with a team of engineers to establish new standards for tomorrow's technology.
• Engage in projects that may involve signal and power integrity and next-generation cooling solutions.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.