JobsAdvanced Packaging Top Die Module Engineer
Intel logo

Advanced Packaging Top Die Module Engineer

Intel

Location

Albuquerque, NM

Type

Full-time

Posted

9/22/2026

Compensation

$103,730 - $198,820 per year

Undergraduate with 2+ Years of Experience
H-1B FY202694.2% approval-88% YoY
💎 Strong sponsor

Job description

The Module Engineer will play a crucial role in enhancing Intel's high-volume manufacturing capabilities by overseeing critical equipment and processes for integrated circuit production. This position is part of Intel's Engineering team, which focuses on advancing semiconductor manufacturing technologies. The engineer will work collaboratively across regions to drive innovation in device miniaturization and ensure high-quality outputs. The role emphasizes continuous improvement in production efficiency, quality, and yield.

Requirements

  • Bachelor's degree in a STEM field or related discipline.
  • 4+ years of relevant experience with a Bachelor's degree; or 3+ years of experience with a Master's degree; or no experience required with a PhD.
  • Proficiency in semiconductor metrology, process characterization, and manufacturing process improvement.
  • Experience in developing and maintaining process controls, identifying excursions, and implementing changes.
  • Strong knowledge of Design of Experiments (DOE) principles and their application in process optimization.
  • Technical expertise in semiconductor manufacturing equipment and processes.

Responsibilities

  • Operate and optimize high-volume manufacturing equipment and processes to maintain control over critical dimensions and defectivity.
  • Conduct tests and measurements to evaluate equipment and process performance, recommending and implementing modifications to improve productivity and quality.
  • Execute maintenance, repair, and upgrades for assigned equipment and modules to ensure consistent operational excellence.
  • Lead continuous improvement initiatives focused on enhancing safety, productivity, cost efficiency, and yield.
  • Develop and implement excursion prevention systems to detect and address discrepant materials or activities in equipment and processes.
  • Facilitate technology transfer to global manufacturing sites through training, audits, and documentation to ensure consistent processing across locations.
  • Oversee installation, conversion, and qualification of equipment during factory ramps, ensuring compliance with safety, quality, and matching standards.
  • Leverage data-driven techniques such as Design of Experiments (DOE) to characterize, control, and improve manufacturing processes.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Intel Corp

As of Aug 23, 2026

Initial approvals

74

FY2026

Approval rate

94.2%

FY2026

LCA certified

2,201

FY2026

Entry-level share

0.1%

FY2026

Initial approvals YoY

-88%

Trend

LCA certified YoY

-54%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

Is this posting expired or inaccurate?