The role is for a member of the Qualcomm Si Process Packaging Solutions team, focusing on Si process technology evaluation and productization for Mixed-Signal/RF products. The candidate will work closely with design and product teams to define requirements and ensure technology support. Responsibilities include driving technology development and optimization for RF designs, as well as innovating methods for continuous improvement. The position requires strong collaboration with internal teams to address design and optimization issues.

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design experience, or a Master's degree with 3+ years, or a PhD with 2+ years.
• Minimum of 8+ years of industrial experience developing advanced CMOS processes and devices.
• Excellent understanding of RF-CMOS, SOI or BiCMOS process integration and design rules.
• Proficiency in device level test-structure development and statistical analysis.
• Good knowledge of RF characterization and technology evaluation.

• Drive bulk Si and RFSOI technology evaluation and design enablement for RF designs.
• Work with Qualcomm design and product teams to define process and device requirements.
• Define and execute test structures DOE, layout, and characterization for process evaluation.
• Design, simulate, and test RF circuits to optimize process-design-layout interaction.
• Support Qualcomm design, layout, PTE, and reliability teams to resolve optimization issues.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.