Job description
The role at Qualcomm Technologies, Inc. focuses on signal integrity and power integrity within the Central Hardware System for next-generation server projects. The candidate will collaborate with IC, package, and PCB designers to optimize overall system performance. Key responsibilities include ensuring system-level constraints are met prior to package tape-out and communicating with various teams to assess the impact of design choices. This position offers the chance to work across multiple organizations, enhancing both technical and collaborative skills.
Requirements
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
- 3+ years of experience in DDR/SerDes in Package/PCB/System Design related to compute, Auto and/or Server projects.
- Experience in Electromagnetics and a solid background in transmission line theory and crosstalk.
- Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity.
- Experience in simulation tools such as ADS and Hspice.
- Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition.
- Experience in utilizing AI to gain efficiency is a strong plus.
- Experience in Matlab.
- Experience in design specifications such as LPDDRx, PCIe, Xlink.
Responsibilities
- Perform package extraction for time domain and frequency domain analysis.
- Conduct system-level analysis for DDR, SerDes, and PDN analysis.
- Develop design guidelines for Package and PCB design.
- Create technical documentation and presentations.
Benefits
- Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.
H-1B filing history
Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026
Filing entity: Qualcomm Technologies Inc
As of Aug 23, 2026
Initial approvals
198
FY2026
Approval rate
98.1%
FY2026
LCA certified
59,278
FY2026
Entry-level share
0.0%
FY2026
Initial approvals YoY
-22%
Trend
LCA certified YoY
+30%
Trend
Initial approvals by fiscal year
Approval rate by fiscal year
Continuing vs initial approvals
LCA certified positions by quarter
LCA certified positions by fiscal year
Based on public USCIS and DOL filings; not a sponsorship guarantee.
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