Intel Corporation is seeking a Quantum IC Substrate Package Layout Design Engineer to join its Quantum Computing Group in Oregon. This role focuses on designing large form factor IC substrates within a multidisciplinary team, contributing to the advancement of silicon quantum dot technology. The successful candidate will play a crucial role in developing scalable quantum systems that aim to revolutionize computing. This position offers the opportunity to work at the forefront of quantum technology development.

• B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
• OR M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
• Experience with Siemens Xpedition design environment and workflow.
• Experience in high-speed signal routing.
• Experience with large form factor IC substrates.

• Design IC substrates using Siemens Xpedition IC package design software.
• Work closely with stakeholders to meet design requirements, including feedback from silicon testchip, signal integrity, power integrity, thermal simulation, and system integration engineers.
• Deliver and disseminate design milestones to stakeholders.
• Conduct design validation and verification, including DRC and LVS.
• Integrate advanced packaging design (2.5D and 3D) with IC substrate.
• Manage tapeout of designs with substrate suppliers in collaboration with Intel substrate teams.
• Communicate designs in presentations and relevant documentation.
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.