The Senior Module Development Engineer will be part of the Advanced Packaging Technology Development Metrology Group at Intel, focusing on the evolution of metrology in semiconductor packaging. This role requires a blend of hands-on expertise with metrology equipment and strategic insight into industry trends. The engineer will ensure that measurement strategies are defined early in development programs and will take ownership of the qualification of new metrology tools. This position demands technical depth and the ability to influence across various teams to resolve complex challenges.

• Bachelor's degree in materials science, electrical engineering, mechanical engineering, chemical engineering, physics, chemistry, or related STEM field with 4+ years of relevant experience.
• Master’s degree in the same fields with 2+ years of relevant experience.
• PhD in the same fields.
• Expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.
• Proficiency in process development methodologies, statistical process control, and manufacturing process improvement.

• Drive technology development and enablement across high-volume manufacturing and future technology nodes.
• Lead the design and development of technically sophisticated metrology and inspection processes.
• Define and own the metrology group's long-range technology roadmap.
• Perform pathfinding activities in support of process and hardware development.
• Conduct process technology feasibility studies through theoretical simulations and practical engineering methods.
• Evaluate and qualify next-generation metrology and inspection equipment end-to-end.
• Serve as the primary technical resource for fab support.
• Recommend and implement equipment and process modifications that improve production efficiency.
• Partner with key equipment and materials suppliers to develop enabling elements of the technology.
• Remain current on relevant industry process, materials, and metrology trends.
• Lead metrology module development across multiple concurrent advanced packaging programs.
• Design and implement rapid inline feedback mechanisms.
• Collaborate with AI, machine learning, and advanced process control teams.
• Represent the metrology group in cross-functional program reviews.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.