JobsAdvanced Packaging Module Development Engineer
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Advanced Packaging Module Development Engineer

Intel

Location

Hillsboro, OR

Type

Full-time

Posted

9/26/2026

Compensation

$133,800 - $255,200 per year

Master's with 2+ Years of Experience
PhD Entry-Level
H-1B FY202694.2% approval-88% YoY
💎 Strong sponsor

Job description

Intel Corporation is seeking a highly motivated Process Integration Engineer to join their team in Hillsboro, Oregon. This role focuses on driving technology development and enablement for high-volume manufacturing and next-generation semiconductor technologies. The engineer will lead the design and development of sophisticated manufacturing processes and collaborate with suppliers and internal teams. This position offers a unique opportunity to impact Intel's strategic roadmap and the semiconductor industry.

Requirements

  • Master's degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field with 4+ years of relevant industry experience, or a PhD degree in the same fields with 3+ years of relevant experience.
  • Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
  • Hands-on experience with robotics, automation systems, vision systems, or image processing.

Responsibilities

  • Drive technology development for high-volume manufacturing and future technology nodes.
  • Lead the design and development of technically sophisticated manufacturing processes.
  • Perform pathfinding activities in support of process and hardware development.
  • Recommend and implement modifications to operating equipment to improve production efficiency.
  • Partner with key equipment and materials suppliers to develop enabling elements of technology.
  • Perform process technology feasibility studies through theoretical simulations and practical engineering methods.
  • Remain current on relevant industrial process and material manufacturing technical trends.
  • Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions.
  • Leverage hands-on experience with robotics, automation systems, vision systems, and image processing.

Benefits

  • Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.

H-1B filing history

Public USCIS petition and DOL LCA counts · latest USCIS FY2026, LCA FY2026

Filing entity: Intel Corp

As of Aug 23, 2026

Initial approvals

74

FY2026

Approval rate

94.2%

FY2026

LCA certified

2,201

FY2026

Entry-level share

0.1%

FY2026

Initial approvals YoY

-88%

Trend

LCA certified YoY

-54%

Trend

Initial approvals by fiscal year

Approval rate by fiscal year

Continuing vs initial approvals

LCA certified positions by quarter

LCA certified positions by fiscal year

Based on public USCIS and DOL filings; not a sponsorship guarantee.

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