The engineer will be a key member of the Process Package Integration and bumping process team at Qualcomm, focusing on technology development and new product introduction. This role involves primary ownership of wafer bumping process integration, qualification, and high-volume readiness across various silicon technology nodes and assembly houses. The engineer will work closely with foundry teams and internal departments to deliver robust bumping solutions for advanced packaging. The position requires strong technical skills and experience in leading bumping process qualification and production activities.

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
• Minimum of 8–10 years hands-on experience in silicon interconnect process, bumping and/or RDL process, new technology qualification and production.

• Define bumping process flows including passivation, UBM, RDL, and bump.
• Establish process windows and controls for bumping processes.
• Lead DOE-based optimization and partner with suppliers to improve yield, reliability, and cost.
• Work closely with foundry FBEOL teams and assembly partners to deliver bumping solutions.
• Lead bumping house/line bring-up, qualification, and ongoing performance management.
• Design and drive novel test vehicles for bump/RDL process characterization.

• Qualcomm offers competitive compensation, annual bonuses, stock programs, comprehensive healthcare coverage, retirement plans, wellness programs, parental leave, flexible work options, and professional development opportunities.