The Hardware Engineering Intern position at IBM Research focuses on semiconductor research, where interns will collaborate with global researchers to develop next-generation chips and systems. The role emphasizes applying scientific and engineering principles to innovative hardware design and applications. Interns will engage in projects related to chip architecture, fabrication, and packaging, contributing to advancements in logic and memory technology. Ideal candidates will have a background in engineering disciplines, computer science, or materials science.

• High School Diploma or GED is required.
• A Bachelor's degree in a relevant field is preferred.
• Knowledge in Electrical Engineering, Mechanical Engineering, Computer Science, Materials Engineering, Physics, or Chemistry is required.
• Experience or coursework in semiconductor fabrication is preferred.

• Investigate the feasibility of applying science and engineering principles to new hardware designs.
• Analyze complex problems and develop creative solutions for hardware engineering projects.
• Work on state-of-the-art chip architecture, design, fabrication, and testing.
• Contribute to advanced chip packaging efforts.

• IBM offers competitive compensation, healthcare coverage, retirement programs, paid parental leave, tuition assistance, wellness programs, flexible work options, and extensive learning and certification resources.