As a Packaging Module Development Engineer at Intel, you will be instrumental in enhancing semiconductor manufacturing through innovative packaging processes and equipment. You will work within the Substrate Packaging Technology Development organization, focusing on high-performance and mobile computing applications. Your role will involve optimizing assembly methods to meet quality and efficiency goals in high-volume environments. Collaboration with cross-functional teams will be key to driving advancements in next-generation packaging technologies.

• PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a similar engineering degree with 1+ years of related experience.
• 1+ year of experience in combining engineering judgment and data analysis skills to draw conclusions, build models, and design experiments.
• Experience in materials science and engineering, and in material characterization techniques.
• Knowledge and experience in design of experiments (DOE), statistical data analysis, and statistical process control (SPC).

• Develop and optimize advanced packaging processes, materials, and equipment to meet reliability, quality, and cost targets.
• Design and implement process specifications, workflows, and equipment configurations for new technologies.
• Conduct design of experiments (DOE) to characterize process windows and interactions between equipment, materials, and chemistry.
• Drive continuous improvement efforts to enhance process capability, stability, and productivity.
• Collaborate with cross-functional teams to resolve technical challenges and deliver impactful solutions.
• Establish material specifications and partner with suppliers to ensure adherence to performance and quality standards.
• Document advancements and process innovations through technical reports and white papers.
• Provide sustaining support for equipment performance and process health in high-volume manufacturing environments.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.