The Packaging Research and Development Engineer will join the Substrate Packaging Technology Development team, focusing on process and material development to advance substrate packaging technology. This role involves significant time on the factory floor and collaboration with equipment and material suppliers. The engineer will contribute to a pioneering embedded die packaging facility, driving innovations in substrate manufacturing. The position requires adaptability and a willingness to engage in continuous process improvements.

• Bachelor's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related with 5+ years of experience.
• Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related with 3+ years of experience.
• PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related with 1+ years of experience.
• Experience in semiconductor manufacturing, technology development, and material development.

• Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies.
• Plan and conduct comprehensive DOEs to characterize process windows and understand interactions between processes, equipment, and materials.
• Drive continuous process improvements in capability, stability, quality, reliability, cost, yield, automation, and productivity.
• Lead and participate in cross-functional teams that support substrate technology development.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.