Intel Corporation is seeking an Advanced Packaging Metrology Engineering Manager to lead a team focused on advanced semiconductor packaging technologies. This role involves driving innovation in wafer-level assembly technologies and ensuring manufacturing readiness. The successful candidate will cultivate a team culture rooted in excellence and collaboration while executing long-term technology strategies. This position is critical to reinforcing Intel's position as a global technology leader.

• Bachelor’s degree in science, engineering, or a related STEM field with 6+ years of relevant experience, or a Master's degree with 4+ years of relevant experience, or a PhD with 4+ years of relevant experience.
• Relevant experience in semiconductor wafer or assembly process, equipment, or materials development.
• Experience in process development methodology, project management, and schedule-based execution.

• Lead and inspire a team of engineers to develop advanced wafer processing and packaging solutions.
• Drive technology enablement, feasibility studies, and module improvement initiatives.
• Ensure successful demonstrations of manufacturing capabilities at high volumes.
• Manage seamless technology transfers to global manufacturing sites.
• Partner with cross-functional teams to deliver process solutions that meet device specifications.
• Collaborate with supplier executive management to implement innovative concepts into manufacturing processes.
• Execute long-term strategies for module engineering to support future technology needs.
• Set clear, measurable team objectives and apply differentiated performance management.
• Coach, mentor, and develop engineers in skills growth and technology road mapping.
• Foster a collaborative, inclusive, and psychologically safe team environment.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.