The Process Integration Engineer role at Intel's Advanced Packaging Technology & Manufacturing organization focuses on enabling advanced packaging manufacturing by developing and qualifying upcoming technology nodes. Located in Rio Rancho, New Mexico, this position involves collaboration with various teams to ensure new processes are ready for high-volume manufacturing. The engineer will play a crucial role in addressing defect, yield, and reliability gaps while contributing to value engineering initiatives. This is a high-impact position where contributions directly influence the success of Intel's next-generation products.

• Bachelor’s degree in engineering, material science, physics, or a related field with 3+ years of relevant experience, or a Master's degree with 2+ years of relevant experience, or a PhD with no prior experience required.
• Relevant experience in Technology Development and/or high-volume manufacturing environment, including process integration, yield analysis, quality management, defects reduction, and process development.
• Knowledge of semiconductor advanced packaging techniques and flows.

• Enable Intel's advanced packaging manufacturing roadmap by developing and qualifying upcoming technology nodes.
• Own and drive closure of defect, yield, reliability, and device entitlement gaps across processes under development.
• Collaborate closely with process module teams to support process readiness reviews and transfer milestones.
• Partner with device, yield, reliability, and packaging teams to develop and deliver robust base die solutions.
• Contribute to value engineering initiatives by identifying cost-effective solutions without compromising quality or performance.
• Support cross-functional problem-solving efforts in a fast-paced and technically complex environment.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.