The role involves working in Intel's Foundry labs, specifically within the transmission electron microscopy group. Engineers will focus on solving technical problems related to semiconductor nanostructures using advanced imaging techniques. The position emphasizes collaboration with engineering teams to optimize metrology strategies and improve manufacturing processes. Continuous learning and adaptation to new methodologies are essential for success in this role.

• An Associate degree with 8 years of work experience, a Bachelor degree with 4 years of work experience, or a Master degree with 2 years of work experience is required.
• Hands-on experience in FIB sample preparation and Transmission Electron Microscopy (TEM) operation in an industrial setting is necessary.
• A strong track record of experience, innovation, and ownership in the FIB and TEM area is preferred.
• Strong communication skills to work effectively with peers and customers are essential.

• Support engineering activities such as fabrication, failure analysis, technology development, process development, and process integration.
• Collaborate with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
• Conduct engineering tasks and detailed technical procedures for sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools.
• Contribute to continuous improvement efforts in high volume manufacturing environments.
• Perform other related duties as required or directed.
• Continuously upgrade skill set and maintain an open attitude towards learning.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.