The Silicon Packaging Design Architect role at Intel involves driving end-to-end package solutions that meet physical, electrical, and cost requirements. This senior engineering position requires collaboration with cross-functional teams to enhance packaging standards and processes. The role is part of the Silicon Packaging Architecture team, which focuses on developing advanced packaging solutions for Intel's silicon technologies. The architect's contributions will significantly impact the transition of designs to production and the advancement of packaging technologies.

• Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, or a STEM-related role with 6+ years of experience, or a Master's degree with 4+ years of experience, or a Ph.D. with 2+ years of experience.
• 2+ years of hands-on experience in semiconductor fabrication, chip assembly, or packaging.
• Experience in electromagnetic simulation tools such as Mentor, Cadence tools, SPICE, Ansys tools, or similar platforms.
• Experience with Cadence Allegro platform tools and/or Mentor Xpedition platform tools.
• In-depth knowledge of assembly processes, test methodologies, and characterization techniques.

• Translate product requirements into detailed package architecture specifications.
• Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards.
• Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks.
• Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards.
• Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions.
• Implement co-design strategies between silicon and board design teams to optimize product performance and cost.
• Collaborate with EDA partners to advance package design tools and optimize design methods.

• Intel offers a comprehensive benefits package including competitive pay, stock programs, healthcare coverage, retirement plans, paid time off, parental leave, and programs supporting employee wellbeing and professional development.